bonding wire

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• bonding wire — termokompresinio suvirinimo viela statusas T sritis radioelektronika atitikmenys: angl. bonding wire vok. Bonddraht, m rus. проволока для термокомпрессионной сварки, f pranc. fil pour soudage à thermocompression, m …   Radioelektronikos terminų žodynas

• bonding wire lead — termokompresiškai prijungtas vielinis išvadas statusas T sritis radioelektronika atitikmenys: angl. bonding wire lead vok. Bonddrahtanschluß, m rus. проволочный вывод, присоединённый методом термокомпрессии, m pranc. sortie en fil connectée par… …   Radioelektronikos terminų žodynas

• Wire bonding — is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication.The wire is generally made up of one of the following: *Gold *Aluminum *CopperWire diameters start at 15 µm and can be up …   Wikipedia

• Wire bonding — es el método más usado para llevar a cabo las conexiones entre los circuitos integrados y la placa de circuito impreso (PCB). Sin embargo, la utilidad del método wire bonding no se limita sólo a este tipo de conexiones, ya que también se puede… …   Wikipedia Español

• Bonding-studenteninitiative e.V. — The bonding studenteninitiative e.V. (short name bonding ) is an independent, non political and non profit student organisation. It was founded in 1988 in Aachen, Germany. The name derives from wire bonding, where interconnections between a… …   Wikipedia

• Bonding jumper — A bonding jumper is a reliable conductor to ensure the required electrical conductivity between metal parts required to be electrically connectedcite book | last = edited by Robert H. Griffin | title = Safety and Health Requirements Manual: U. S …   Wikipedia

• wire bonding — termokompresinis vielos prijungimas statusas T sritis radioelektronika atitikmenys: angl. wire bonding vok. Drahtbonden, n rus. проволочная термокомпрессия, f; термокомпрессионное присоединение проволочных выводов, n pranc. soudage à… …   Radioelektronikos terminų žodynas

• wire bonding — vielinių išvadų prijungimas statusas T sritis radioelektronika atitikmenys: angl. wire bonding vok. Drahtbondung, f rus. присоединение проволочных выводов, n pranc. connexion des sorties en fil, f …   Radioelektronikos terminų žodynas

• Wire bonding — Das Drahtbonden (von engl. bond Verbindung , Haftung ) bezeichnet in der Elektronik Fertigung einen Verfahrensschritt, bei dem mittels dünner Drähte (Bonddraht) ein Chip (engl. die, zum Beispiel ein integrierter Schaltkreis, eine Leuchtdiode, ein …   Deutsch Wikipedia

• Ball bonding — is a type of wire bonding, and is the most common way to make the electrical interconnections between a microchip and the outside world as part of semiconductor device fabrication.Gold or copper wire can be used, though gold is more common… …   Wikipedia

• Electrical bonding — is the practice of intentionally electrically connecting all metallic non current carrying items in a room or building as protection from electric shock. If a failure of electrical insulation occurs, all metal objects in the room will have the… …   Wikipedia